02 / WAFERS

Polycrystalline CVD Diamond Wafers for Thermal Management and Engineering Applications

Supplier-listed diameter range 5–100 mm and thickness 0.2–2.0 mm (customizable). Supplier-stated thermal conductivity: 1,200–1,800 W/m·K. Choose an as-grown surface or double-side grinding.

Specifications

MaterialPolycrystalline CVD diamond
Diameter5–100 mm
Thickness0.2–2.0 mm; customizable
Thermal conductivity1,200–1,800 W/m·K
Surface optionsAs-grown surface or double-side ground

Listed dimensions and performance values reflect current supplier information and should be confirmed for the selected batch.

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Applications

For thermal management and other engineering applications. Batch-specific performance and availability are confirmed per inquiry.